>24/30502824 DC BS EN IEC 60749-22-1 Semiconductor devices - Mechanical and climatic test methods Part 22-1: Bond strength - wire bond pull test methods
sklademVydáno: 2024-12-13
24/30502824 DC
BS EN IEC 60749-22-1 Semiconductor devices - Mechanical and climatic test methods Part 22-1: Bond strength - wire bond pull test methods
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24/30502824 DC
Počet stran:
65
Vydáno:
2024-12-13
Status:
Draft for Comment
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24/30502824 DC
This standard 24/30502824 DC BS EN IEC 60749-22-1 Semiconductor devices - Mechanical and climatic test methods is classified in these ICS categories:
