BS 5909:1980

This standard BS 5909:1980 Method for scale adhesion test for oxygen-free copper is classified in these ICS categories:

• 77.040.99 Other methods of testing of metals

This International Standard specifies a procedure for the scale adhesion testing of oxygen-free high-conductivity copper.

Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.