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>BS EN IEC 60749-20-1:2026 Semiconductor devices ? Mechanical and climatic test methods Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
sklademVydáno: 2026-03-09
BS EN IEC 60749-20-1:2026 Semiconductor devices ? Mechanical and climatic test methods Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

BS EN IEC 60749-20-1:2026

Semiconductor devices ? Mechanical and climatic test methods Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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Označení normy:BS EN IEC 60749-20-1:2026
Počet stran:44
Vydáno:2026-03-09
ISBN:978 0 539 41388 5
Status:Standard
DESCRIPTION

BS EN IEC 60749-20-1:2026


This standard BS EN IEC 60749-20-1:2026 Semiconductor devices ? Mechanical and climatic test methods is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general