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>BS EN IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards
sklademVydáno: 2023-09-13
BS EN IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards

BS EN IEC 61189-2-803:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards

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Označení normy:BS EN IEC 61189-2-803:2023
Počet stran:14
Vydáno:2023-09-13
ISBN:978 0 539 01306 1
Status:Standard
DESCRIPTION

BS EN IEC 61189-2-803:2023


This standard BS EN IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).
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