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sklademVydáno: 2021-11-05
BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA
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| Označení normy: | BS EN IEC 61189-2-807:2021 |
| Počet stran: | 14 |
| Vydáno: | 2021-11-05 |
| ISBN: | 978 0 539 12605 1 |
| Status: | Standard |
DESCRIPTION
BS EN IEC 61189-2-807:2021
This standard BS EN IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
- 31.180 Printed circuits and boards
- 35.100.01 Open systems interconnection in general