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>BS EN IEC 61189-2-809:2025 Test methods for electrical materials, circuit boards and other interconnection structures and assemblies X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
sklademVydáno: 2025-02-04
BS EN IEC 61189-2-809:2025 Test methods for electrical materials, circuit boards and other interconnection structures and assemblies X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

BS EN IEC 61189-2-809:2025

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

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Označení normy:BS EN IEC 61189-2-809:2025
Počet stran:14
Vydáno:2025-02-04
ISBN:978 0 539 18767 0
Status:Standard
DESCRIPTION

BS EN IEC 61189-2-809:2025


This standard BS EN IEC 61189-2-809:2025 Test methods for electrical materials, circuit boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 29.035.10 Paper and board insulating materials
  • 31.180 Printed circuits and boards
IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.
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