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>BS EN IEC 61189-3-302:2025 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
sklademVydáno: 2025-12-02

BS EN IEC 61189-3-302:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

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Označení normy:BS EN IEC 61189-3-302:2025
Počet stran:24
Vydáno:2025-12-02
ISBN:978 0 539 31019 1
Status:Standard
DESCRIPTION

BS EN IEC 61189-3-302:2025


This standard BS EN IEC 61189-3-302:2025 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards

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