PRICES include / exclude VAT
sklademVydáno: 2010-02-25
IEC 60191-6-19:2010
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-19: Méthodes de mesure du gauchissement des boîtiers à température élevée et du gauchissement maximum admissible
Format
Availability
Price and currency
Anglicky/Francouzsky Hardcopy
skladem
94.51 €
Anglicky/Francouzsky PDF
Immediate download
Printable
94.51 €
| Označení normy: | IEC 60191-6-19:2010 |
| Vydáno: | 2010-02-25 |
| Edice: | 1 |
| ICS: | 31.080.01 |
| Počet stran (Anglicky/Francouzsky): | 25 |
| ISBN (Anglicky/Francouzsky): | 9782889100668 |
DESCRIPTION
IEC 60191-6-19:2010
IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.