Log inSign up
LANGUAGE czen
Menu
ContactSTOREFAQNews
SEARCH
0
Total price
0 €
PRICES include / exclude VAT
Homepage>IEC 60191-6-5:2001 - Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
sklademVydáno: 2001-08-27
IEC 60191-6-5:2001 - Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

IEC 60191-6-5:2001

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Format
Availability
Price and currency
Anglicky Hardcopy
skladem
46.05 €
Anglicky PDF
Immediate download
46.05 €
Označení normy:IEC 60191-6-5:2001
Vydáno:2001-08-27
Edice:1
ICS:31.080.01
DESCRIPTION

IEC 60191-6-5:2001

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

Print