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sklademVydáno: 2025-10-22
IEC 61189-3-302:2025
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles – Partie 3-302: Détection des défauts de métallisation dans les cartes de circuits imprimés nus par tomographie informatisée (TI)
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Anglicky PDF
Immediate download
Printable
134.77 €
Anglicky/Francouzsky Hardcopy
skladem
134.77 €
Anglicky/Francouzsky PDF
Immediate download
Printable
134.77 €
Anglicky Hardcopy
skladem
134.77 €
| Označení normy: | IEC 61189-3-302:2025 |
| Vydáno: | 2025-10-22 |
| Edice: | 1 |
| ICS: | 31.180 |
| Počet stran (Anglicky): | 17 |
| ISBN (Anglicky): | 9782832707777 |
| Počet stran (Anglicky/Francouzsky): | 34 |
| ISBN (Anglicky/Francouzsky): | 9782832707777 |
DESCRIPTION
IEC 61189-3-302:2025
IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.