IEC 61837-2:2018+AMD1:2020 CSV
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la fréquence - Encombrements normalisés et connexions des sorties - Partie 2: Enveloppes en céramique
| Označení normy: | IEC 61837-2:2018+AMD1:2020 CSV |
| Vydáno: | 2020-09-24 |
| Edice: | 3.1 |
| ICS: | 31.140 |
IEC 61837-2:2018+AMD1:2020 CSV
IEC 61837-2:2018+A1:2020 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition:
a. revision of the figures to match the notation of the drawings of IEC 61240:2016;
b. addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
This consolidated version consists of the third edition (2018) and its amendment 1 (2020). Therefore, no need to order amendment in addition to this publication.