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11095 results

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IEC 60191-6-17:2011
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Vydáno: 2011-01-27

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IEC 60191-2:1966/AMD9:2003
Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Vydáno: 2003-11-19

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IEC 60191-2:1966/AMD18:2011
Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Vydáno: 2011-11-22

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IEC 60169-28:1994
Radio-frequency connectors - Part 28: Radio-frequency coaxial connectors with inner diameter of outer conductor of 5,60 mm (0,220 in) with snap-on coupling - Characteristic impedance 75 ohms

Vydáno: 1994-01-31

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IEC 60189-3:2007
Low-frequency cables and wires with PVC insulation and PVC sheath - Part 3: Equipment wires with solid or stranded conductor wires, PVC insulated, in singles, pairs and triples

Vydáno: 2007-05-23

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IEC 60191-2:1966/AMD4:2001
Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Vydáno: 2001-11-27

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IEC 60191-6-5:2001
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Vydáno: 2001-08-27

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IEC 60191-6-19:2010
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Vydáno: 2010-02-25

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IEC 60216-2:2005
Electrical insulating materials - Thermal endurance properties - Part 2: Determination of thermal endurance properties of electrical insulating materials - Choice of test criteria

Vydáno: 2005-08-11

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IEC 60191-6:2009
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Vydáno: 2009-11-26

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IEC 60192:2001
Low-pressure sodium vapour lamps - Performance specifications

Vydáno: 2001-05-22

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IEC 60191-6-3:2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Vydáno: 2000-09-29

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11095 results

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