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Current revisionPublished date: 01.03.2024
IPC-J-STD-005 - Revision B
Requirements for Solder Pastes
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Chinese Secure PDF
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94.73 €
Chinese Hardcopy
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142.09 €
English Secure PDF
Immediate download
Non-printable
94.73 €
English Hardcopy
10-14 dní
142.09 €
View table of Contents
| Standard Number: | IPC-J-STD-005 - Revision B |
| Published date: | 01.03.2024 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | B |
| ISBN (English): | 978-1-63816-170-7 |
| Pages (English): | 24 |
| ISBN (Chinese): | 978-1-63816-220-9 |
| Pages (Chinese): | 22 |
DESCRIPTION
IPC J-STD-005B standard lists the requirements for qualification and characterization of solder paste. It references test methods, criteria, and metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment.