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>IPC-SM-784 - Standard Only
 Current revisionPublished date: 01.11.1990
IPC-SM-784 - Standard Only

IPC-SM-784 - Standard Only

Guidelines for Chip-on-Board Technology Implementation

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Standard Number:IPC-SM-784 - Standard Only
Published date:01.11.1990
DOD Adopted:No
ANSI Approved:No
Pages (English):53
DESCRIPTION

Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques. 53 pages. Released November 1990.