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IPC-J-STD-001 - Revision H - Space and Military Addendum
Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
Published date: 01.05.2021
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238.10 €
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238.10 €
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224.44 €
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336.66 €
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224.44 €
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336.66 €
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224.44 €
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336.66 €
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158.73 €
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IPC-J-STD-001-IPC-A-610 - Revision J - Automotive Addendum
Automotive Addendum to IPC J‑STD‑001J Requirements for Soldered Electrical and Electronic Assemblies and IPC‑A‑610J Acceptability of Electronic Assemblies
Automotive Addendum to IPC J‑STD‑001J Requirements for Soldered Electrical and Electronic Assemblies and IPC‑A‑610J Acceptability of Electronic Assemblies
Published date: 13.09.2025
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236.39 €
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IPC-J-STD-001 - Revision J - Redline
Requirements for Soldered Electrical and Electronic Assemblies - Redline
Requirements for Soldered Electrical and Electronic Assemblies - Redline
Published date: 01.03.2024
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IPC-J-STD-005 - Revision B
Requirements for Solder Pastes
Requirements for Solder Pastes
Published date: 01.03.2024
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IPC-J-STD-006 - Revision B - With Amendment 1-2
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Published date: 22.10.2009
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IPC-J-STD-020 - Revision F
Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
Published date: 01.11.2022
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IPC-J-STD-032- Standard Only
Performance Standard for Ball Grid Array Balls
Performance Standard for Ball Grid Array Balls
Published date: 01.06.2002
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IPC-SM-784 - Standard Only
Guidelines for Chip-on-Board Technology Implementation
Guidelines for Chip-on-Board Technology Implementation
Published date: 01.11.1990
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IPC-T-50 - Revision M
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published date: 26.05.2015
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IPC-TP-1113 - Standard Only
Circuit Board Ionic Cleanliness Measurement: What Does it Tell Us?
Circuit Board Ionic Cleanliness Measurement: What Does it Tell Us?
Published date: 01.01.1994
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IPC-TR-486 - Standard Only
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
Published date: 01.07.2001
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IPC-TR-582 - Standard Only
Cleaning & Cleanliness Test Program for Phase 3-Low Solids Fluxes & Pastes Processed in Ambiant Air
Cleaning & Cleanliness Test Program for Phase 3-Low Solids Fluxes & Pastes Processed in Ambiant Air
Published date: 01.10.2017
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