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sklademVydáno: 2020-12-08
20/30427157 DC
BS IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-808. Thermal resistance of dielectric layer by thermal transient method
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Označení normy: | 20/30427157 DC |
Počet stran: | 17 |
Vydáno: | 2020-12-08 |
Status: | Draft for Comment |
DESCRIPTION
20/30427157 DC
This standard 20/30427157 DC BS IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies is classified in these ICS categories:
- 31.180 Printed circuits and boards
- 35.100.01 Open systems interconnection in general