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Main page>ASTM F3147-15 - Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend
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Vydáno: 01.06.2015

F3147-15

Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend

CURRENCY
44.75 €
Označení normy:F3147-15
Vydáno:01.06.2015
Status:Active
Počet stran:3
Sekce:10.04
Označení:bend; conductive adhesive; encapsulant; land-pad; mandrel; printed flexible circuit; SMD; staking compound;
DESCRIPTION

1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility

1.2 A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).

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