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Published date: 02.06.2017
IPC-7091 - Standard Only
Design and Assembly Process Implementation of 3D Components
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| Standard Number: | IPC-7091 - Standard Only |
| Published date: | 02.06.2017 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| ISBN (English): | 978-1-61193-310-9 |
| Pages (English): | 108 |
DESCRIPTION
Superseded by IPC-7091 - Revision A
The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are surface mounted and some of which are integrated (embedded) within the components’ substrate structure.