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Published date: 01.06.2019
IPC-7095 - Revision D - With Amendment 1
Design and Assembly Process Implementation for BGAs
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Chinese Secure PDF
Immediate download
Non-printable
168.97 €
Chinese Hardcopy
10-14 dní
253.46 €
English Secure PDF
Immediate download
Non-printable
168.97 €
English Hardcopy
10-14 dní
253.46 €
Japanese Secure PDF
Immediate download
Non-printable
253.46 €
Japanese Hardcopy
10-14 dní
380.19 €
View table of Contents
| Standard Number: | IPC-7095 - Revision D - With Amendment 1 |
| Published date: | 01.06.2019 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | D |
| ISBN (English): | 978-1-61193-486-1 |
| Pages (English): | 208 |
| ISBN (Chinese): | 978-1-61193-491-5 |
| Pages (Chinese): | 208 |
| ISBN (Japanese): | 978-1-951577-22-3 |
| Pages (Japanese): | 208 |
DESCRIPTION
Superseded by IPC-7095 - Revision E
The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides descriptions on how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.