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Published date: 01.06.2019
IPC-7095 - Revision D - With Amendment 1
Design and Assembly Process Implementation for BGAs
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Chinese Secure PDF
Immediate download
Non-printable
171.40 €
Chinese Hardcopy
10-14 dní
257.11 €
English Secure PDF
Immediate download
Non-printable
171.40 €
English Hardcopy
10-14 dní
257.11 €
Japanese Secure PDF
Immediate download
Non-printable
257.11 €
Japanese Hardcopy
10-14 dní
385.66 €
View table of Contents
| Standard Number: | IPC-7095 - Revision D - With Amendment 1 |
| Published date: | 01.06.2019 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | D |
| ISBN (English): | 978-1-61193-486-1 |
| Pages (English): | 208 |
| ISBN (Chinese): | 978-1-61193-491-5 |
| Pages (Chinese): | 208 |
| ISBN (Japanese): | 978-1-951577-22-3 |
| Pages (Japanese): | 208 |
DESCRIPTION
Superseded by IPC-7095 - Revision E
The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides descriptions on how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.