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Current revisionPublished date: 12.09.2024
IPC-7095 - Revision E
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
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Chinese Zabezpečené PDF
K okamžitému stažení
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4120 Kč
Chinese Tisk
10-14 dní
6180 Kč
English Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4120 Kč
English Tisk
10-14 dní
6180 Kč
View table of Contents
| Standard Number: | IPC-7095 - Revision E |
| Published date: | 12.09.2024 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | E |
| ISBN (English): | 978-1-63816-179-0 |
| Pages (English): | 208 |
| ISBN (Chinese): | 978-1-63816-232-2 |
| Pages (Chinese): | 208 |
Popis
The IPC-7095E describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095E provides the useful and practical information to those who use or are considering using BGAs. IPC-7095E provides descriptions on how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.