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Published date: 30.03.2017
IPC-7530 - Revision A
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
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Chinese Secure PDF
Immediate download
Non-printable
169.42 €
Chinese Hardcopy
10-14 dní
254.13 €
English Secure PDF
Immediate download
Non-printable
169.42 €
English Hardcopy
10-14 dní
254.13 €
Japanese Secure PDF
Immediate download
Non-printable
237.02 €
Japanese Hardcopy
10-14 dní
355.53 €
View table of Contents
| Standard Number: | IPC-7530 - Revision A |
| Published date: | 30.03.2017 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | A |
| ISBN (English): | 978-1-61193-303-1 |
| Pages (English): | 42 |
| ISBN (Chinese): | 978-1-61193-466-3 |
| Pages (Chinese): | 52 |
| ISBN (Japanese): | 978-1-63816-099-1 |
| Pages (Japanese): | 52 |
DESCRIPTION
Superseded by IPC-7530 - Revision B
This standard provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This revision expands the focus of the original standard from reflow profiling to include profiling for vapor phase, laser, selective soldering and wave soldering. The revision also includes a full-color troubleshooting guide for addressing common defects which can be attributed to profiling. 42 pages. Released March 2017