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Current revisionPublished date: 01.04.1999
IPC-9502 - Standard Only
PWB Assembly Soldering Process Guideline for Electronic Components
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| Standard Number: | IPC-9502 - Standard Only |
| Published date: | 01.04.1999 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Pages (English): | 25 |
DESCRIPTION
This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and IPC/JEDEC J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.