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>IPC-CM-770 - Revision E
 Current revisionPublished date: 01.01.2004
IPC-CM-770 - Revision E

IPC-CM-770 - Revision E

Component Mounting Guidelines for Printed Boards

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Standard Number:IPC-CM-770 - Revision E
Published date:01.01.2004
DOD Adopted:No
ANSI Approved:No
Revision:E
Pages (English):150
DESCRIPTION

This revision provides effective guidelines in the preparation and attachment of components for printed circuit board assembly and reviews pertinent design criteria, impacts and issues. It contains techniques for assembly (both manual and machines including SMT, BGA and flip chip) and consideration of, and impact upon, subsequent soldering, cleaning, and coating processes. 150 pages. Revised January 2004.