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Current revisionPublished date: 01.02.2003
IPC-J-STD-027 - Standard Only
Mechanical Outline Standard for Flip Chip and Chip Size Configurations
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| Standard Number: | IPC-J-STD-027 - Standard Only |
| Published date: | 01.02.2003 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Pages (English): | 96 |
DESCRIPTION
This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 20 Pages. Released February 2003.