IPC-J-STD-609 - Revision C

This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of:

1. those assemblies that are assembled with lead-containing or lead-free solder;

2. components that have lead-containing or lead-free second level interconnect terminal finishes and materials;

3. the maximum component temperature not to be exceeded during assembly or rework processing;

4. the base materials used in the PCB construction, including those PCBs that use halogen-free resin;

5. the surface finish of PCBs; and the conformal coating on PCBAs.