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>IPC-PE-740 - Revision A
 Current revisionPublished date: 01.12.1997
IPC-PE-740 - Revision A

IPC-PE-740 - Revision A

Troubleshooting for Printed Board Manufacture and Assembly

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Standard Number:IPC-PE-740 - Revision A
Published date:01.12.1997
DOD Adopted:No
ANSI Approved:No
Revision:A
Pages (English):391
DESCRIPTION

This is the document all process engineers must have! Useful for day-to-day problem solving, it contains case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has been updated to reflect today's manufacturing challenges. Sections address documentation, phototooling, raw materials, mechanical operations, hole preparation, plated-through hole, cleaning procedures, imaging, electroplating, etching, innerlayer fabrication lamination, soldering, metallic protective coatings, non-metallic protective coatings, component preparation and assembly, inspection and test, and rework and repair. This revision features an expanded assembly chapter that includes soldering, cleaning and post soldering process. Also new to this revision are examples of additional processes for troubleshooting. And, as an enhancement, an easy-to-use index has been added to help you find your process problem. 391 pages. Released December 1997.