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>UNE EN 60068-2-58:2015/A1:2018 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by Asociación Española de Normalización in May of 2018.)
sklademVydáno: 2018-05-01
UNE EN 60068-2-58:2015/A1:2018 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by Asociación Española de Normalización in May of 2018.)

UNE EN 60068-2-58:2015/A1:2018

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by Asociación Española de Normalización in May of 2018.)

Ensayos ambientales. Parte 2-58: Ensayos. Ensayo Td: Métodos de ensayo de soldabilidad, resistencia de la metalización a la disolución y resistencia de los componentes para montaje en superficie (SMD) al calor de la soldadura. (Ratificada por la Asociación Española de Normalización en mayo de 2018.)

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Označení normy:UNE EN 60068-2-58:2015/A1:2018
Počet stran:16
Vydáno:2018-05-01
Status:Změna
DESCRIPTION

UNE EN 60068-2-58:2015/A1:2018

In 2nd paragraph, replace the solderability and resistance to soldering heat by the the solderability, resistance to dissolution of metallization and to soldering heat (Current) This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys (New) This standard provides procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

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