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sklademVydáno: 2012-07-01
UNE EN 60749-20:2009
Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (Endorsed by AENOR in July of 2012.)
Dispositivos de semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 20: Resistencia de los dispositivos de montaje superficial (SMD) encapsulados en plástico al efecto combinado de humedad y de calor de soldadura. (Ratificada por AENOR en julio de 2012.)
CURRENCY
| Označení normy: | UNE EN 60749-20:2009 |
| Počet stran: | 31 |
| Vydáno: | 2012-07-01 |
DESCRIPTION
This standard UNE EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (Endorsed by AENOR in July of 2012.) is classified in these ICS categories:
- 31.080.01
Categories: