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sklademVydáno: 2017-10-01
UNE EN 61191-3:2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)
Conjuntos de tarjetas con circuito impreso. Parte 3: Especificación intermedia. Conjuntos de montaje soldado a través de tablero. (Ratificada por la Asociación Española de Normalización en octubre de 2017.)
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| Označení normy: | UNE EN 61191-3:2017 |
| Počet stran: | 30 |
| Vydáno: | 2017-10-01 |
| Status: | Norma |
DESCRIPTION
UNE EN 61191-3:2017
This part of IEC 61191 prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
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