This part of ISO 9455 specifies a qualitative method for assessing the solubility of flux residues in a selected solvent. The method is applicable to all fluxes of Type 1, as defined in ISO 9454-1. NOTE This test gives no assurance that post-cleaning residues, which may be present in sufficiently small amounts to pass the test, will not be detrimental to the soldered assembly in the long term.