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32116 results
First page123...844846848...267526762677Last page
UNE EN 60153-1:2016
Hollow metallic waveguides - Part 1: General requirements and measuring methods (Endorsed by AENOR in October of 2016.)
Vydáno: 2016-10-01
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UNE EN 60153-2:2016
Hollow metallic waveguides - Part 2: Relevant specifications for ordinary rectangular waveguides (Endorsed by AENOR in October of 2016.)
Vydáno: 2016-10-01
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UNE EN 60153-2:2016/AC:2017-02
Hollow metallic waveguides - Part 2: Relevant specifications for ordinary rectangular waveguides (Endorsed by Asociación Española de Normalización in March of 2017.)
Vydáno: 2017-03-01
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UNE EN 60154-2:2016
Flanges for waveguides - Part 2: Relevant specifications for flanges for ordinary rectangular waveguides (Endorsed by Asociación Española de Normalización in January of 2017.)
Vydáno: 2017-01-01
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UNE EN 60154-4:2017
Flanges for waveguides - Part 4: Relevant specifications for flanges for circular waveguides (Endorsed by Asociación Española de Normalización in September of 2017.)
Vydáno: 2017-09-01
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UNE EN 60169-25:1993
RADIO-FREQUENCY CONNECTORS. PART 25: TWO-POLO SCREW (3/4-20 UNEF) COUPLED CONNECTORS FOR USE WITH SHIELDED BALANCED CABLES HAVING TWIN INNER CONDUCTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 13,56 MM (0,534 IN) (TYPE TWHN). (Endorsed by AENOR in November of 1995.)
Vydáno: 1995-11-01
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UNE EN 60191-6-19:2010
Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.)
Vydáno: 2010-09-01
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UNE EN 60191-6-22:2013
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (Endorsed by AENOR in April of 2013.)
Vydáno: 2013-04-01
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UNE EN 60191-6-3:2000
Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.)
Vydáno: 2001-12-01
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UNE EN 60216-1:2013
Electrical insulating materials - Thermal endurance properties - Part 1: Ageing procedures and evaluation of test results (Endorsed by AENOR in October of 2013.)
Vydáno: 2013-10-01
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UNE EN 60216-2:2005
Electrical insulating materials - Thermal endurance properties -- Part 2: Determination of thermal endurance properties of electrical insulating materials - Choice of test criteria (Endorsed by AENOR in December of 2005.)
Vydáno: 2005-12-01
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UNE EN 60216-8:2013
Electrical insulating materials - Thermal endurance properties - Part 8: Instructions for calculating thermal endurance characteristics using simplified procedures (Endorsed by AENOR in October of 2013.)
Vydáno: 2013-10-01
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32116 results
First page123...844846848...267526762677Last page