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Current revisionPublished date: 01.05.2021
IPC-4552 - Revision B
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
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Availability
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Chinese Secure PDF
Immediate download
Non-printable
200.47 €
Chinese Hardcopy
10-14 dní
300.71 €
English Secure PDF
Immediate download
Non-printable
200.47 €
English Hardcopy
10-14 dní
300.71 €
Japanese Secure PDF
Immediate download
Non-printable
200.47 €
Japanese Hardcopy
10-14 dní
300.71 €
View table of Contents
| Standard Number: | IPC-4552 - Revision B |
| Published date: | 01.05.2021 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | B |
| ISBN (English): | 978-1-63816-050-2 |
| Pages (English): | 156 |
| ISBN (Chinese): | 978-1-63816-050-2 |
| Pages (Chinese): | 156 |
| ISBN (Japanese): | 978-1-63816-281-0 |
| Pages (Japanese): | 156 |
DESCRIPTION
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.