Cena s DPH / bez DPH
Current revisionPublished date: 01.05.2021
IPC-4552 - Revision B
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
Formát
Dostupnost
Cena a měna
Chinese Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4881 Kč
Chinese Tisk
10-14 dní
7322 Kč
English Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4881 Kč
English Tisk
10-14 dní
7322 Kč
Japanese Zabezpečené PDF
K okamžitému stažení
Netisknutelné
4881 Kč
Japanese Tisk
10-14 dní
7322 Kč
View table of Contents
| Standard Number: | IPC-4552 - Revision B |
| Published date: | 01.05.2021 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | B |
| ISBN (English): | 978-1-63816-050-2 |
| Pages (English): | 156 |
| ISBN (Chinese): | 978-1-63816-050-2 |
| Pages (Chinese): | 156 |
| ISBN (Japanese): | 978-1-63816-281-0 |
| Pages (Japanese): | 156 |
Popis
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.