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>IPC-6012 - Revision D
Published date: 22.09.2015
IPC-6012 - Revision D

IPC-6012 - Revision D

Qualification and Performance Specification for Rigid Printed Boards

Format
Availability
Price and currency
Chinese Secure PDF
Immediate download
Non-printable
170.26 €
Chinese Hardcopy
10-14 dní
255.39 €
English Secure PDF
Immediate download
Non-printable
170.26 €
English Hardcopy
10-14 dní
255.39 €
French Secure PDF
Immediate download
Non-printable
263.13 €
French Hardcopy
10-14 dní
394.69 €
German Secure PDF
Immediate download
Non-printable
263.13 €
German Hardcopy
10-14 dní
394.69 €
Japanese Secure PDF
Immediate download
Non-printable
263.13 €
Japanese Hardcopy
10-14 dní
394.69 €
Polish Secure PDF
Immediate download
Non-printable
263.13 €
Polish Hardcopy
10-14 dní
394.69 €
Spanish Secure PDF
Immediate download
Non-printable
170.26 €
Spanish Hardcopy
10-14 dní
255.39 €
Turkish Secure PDF
Immediate download
Non-printable
263.13 €
Turkish Hardcopy
10-14 dní
394.69 €
View table of Contents
Standard Number:IPC-6012 - Revision D
Published date:22.09.2015
DOD Adopted:No
ANSI Approved:No
Revision:D
ISBN (English):978-1-61193-199-0
Pages (English):59
ISBN (Chinese):978-1-61193-242-3
Pages (Chinese):58
ISBN (German):978-1-61193-209-6
Pages (German):59
ISBN (French):978-1-61193-243-0
Pages (French):59
ISBN (Japanese):978-1-61193-437-3
Pages (Japanese):74
ISBN (Polish):978-1-61193-478-6
Pages (Polish):68
ISBN (Spanish):978-1-61193-267-6
Pages (Spanish):59
ISBN (Turkish):978-1-61193-424-3
Pages (Turkish):68
DESCRIPTION

Superseded by IPC-6012 - Revision E

This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision D incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias and dielectric removal. For use with IPC-6011. Supersedes IPC-6012C and IPC-6016.