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>IPC-6012 - Revision D
Published date: 22.09.2015
IPC-6012 - Revision D

IPC-6012 - Revision D

Qualification and Performance Specification for Rigid Printed Boards

Format
Availability
Price and currency
Chinese Secure PDF
Immediate download
Non-printable
169.63 €
Chinese Hardcopy
10-14 dní
254.44 €
English Secure PDF
Immediate download
Non-printable
169.63 €
English Hardcopy
10-14 dní
254.44 €
French Secure PDF
Immediate download
Non-printable
262.15 €
French Hardcopy
10-14 dní
393.23 €
German Secure PDF
Immediate download
Non-printable
262.15 €
German Hardcopy
10-14 dní
393.23 €
Japanese Secure PDF
Immediate download
Non-printable
262.15 €
Japanese Hardcopy
10-14 dní
393.23 €
Polish Secure PDF
Immediate download
Non-printable
262.15 €
Polish Hardcopy
10-14 dní
393.23 €
Spanish Secure PDF
Immediate download
Non-printable
169.63 €
Spanish Hardcopy
10-14 dní
254.44 €
Turkish Secure PDF
Immediate download
Non-printable
262.15 €
Turkish Hardcopy
10-14 dní
393.23 €
View table of Contents
Standard Number:IPC-6012 - Revision D
Published date:22.09.2015
DOD Adopted:No
ANSI Approved:No
Revision:D
ISBN (English):978-1-61193-199-0
Pages (English):59
ISBN (Chinese):978-1-61193-242-3
Pages (Chinese):58
ISBN (German):978-1-61193-209-6
Pages (German):59
ISBN (French):978-1-61193-243-0
Pages (French):59
ISBN (Japanese):978-1-61193-437-3
Pages (Japanese):74
ISBN (Polish):978-1-61193-478-6
Pages (Polish):68
ISBN (Spanish):978-1-61193-267-6
Pages (Spanish):59
ISBN (Turkish):978-1-61193-424-3
Pages (Turkish):68
DESCRIPTION

Superseded by IPC-6012 - Revision E

This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision D incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias and dielectric removal. For use with IPC-6011. Supersedes IPC-6012C and IPC-6016.