IPC-6012 - Revision E
Qualification and Performance Specification for Rigid Printed Boards
| Standard Number: | IPC-6012 - Revision E |
| Published date: | 01.02.2020 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | E |
| ISBN (English): | 978-1-951577-09-4 |
| Pages (English): | 76 |
| ISBN (Chinese): | 978-1-951577-20-9 |
| Pages (Chinese): | 76 |
| ISBN (German): | 978-1-951577-54-4 |
| Pages (German): | 80 |
| ISBN (Japanese): | 978-1-951577-57-5 |
| Pages (Japanese): | 78 |
Superseded by IPC-6012 - Revision F
IPC-6012E specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012E incorporates many new and expanded requirements in areas such as back-drilled structures, alternative surface finishes, copper wrap plating, marking inks, solderability testing, plating overhang, microsection evaluation, thermal shock and performance-based testing for microvia structures. For use with IPC-6011. Supersedes IPC-6012D.