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Published date: 24.10.2011
IPC-7525 - Revision B
Stencil Design Guidelines
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Availability
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Chinese Secure PDF
Immediate download
Non-printable
95.10 €
Chinese Hardcopy
10-14 dní
142.64 €
English Secure PDF
Immediate download
Non-printable
95.10 €
English Hardcopy
10-14 dní
142.64 €
German Secure PDF
Immediate download
Non-printable
132.79 €
German Hardcopy
10-14 dní
199.19 €
View table of Contents
| Standard Number: | IPC-7525 - Revision B |
| Published date: | 24.10.2011 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | B |
| ISBN (English): | 978-1-61193-020-7 |
| Pages (English): | 14 |
| ISBN (Chinese): | 978-1-61193-125-9 |
| Pages (Chinese): | 14 |
| ISBN (German): | 978-1-61193-085-6 |
| Pages (German): | 36 |
DESCRIPTION
Superseded by IPC-7525 - Revision C
This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.