Cena s DPH / bez DPH
Published date: 24.10.2011
IPC-7525 - Revision B
Stencil Design Guidelines
Formát
Dostupnost
Cena a měna
Chinese Zabezpečené PDF
K okamžitému stažení
Netisknutelné
2316 Kč
Chinese Tisk
10-14 dní
3473 Kč
English Zabezpečené PDF
K okamžitému stažení
Netisknutelné
2316 Kč
English Tisk
10-14 dní
3473 Kč
German Zabezpečené PDF
K okamžitému stažení
Netisknutelné
3233 Kč
German Tisk
10-14 dní
4850 Kč
View table of Contents
| Standard Number: | IPC-7525 - Revision B |
| Published date: | 24.10.2011 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | B |
| ISBN (English): | 978-1-61193-020-7 |
| Pages (English): | 14 |
| ISBN (Chinese): | 978-1-61193-125-9 |
| Pages (Chinese): | 14 |
| ISBN (German): | 978-1-61193-085-6 |
| Pages (German): | 36 |
Popis
Superseded by IPC-7525 - Revision C
This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.