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Main page>IPC-A-600 - Revision H
  Published date: 13.04.2010
IPC-A-600 - Revision H

IPC-A-600 - Revision H

Acceptability of Printed Boards

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Chinese Secure PDF
Immediate download
Non-printable
271.77 €
Chinese Hardcopy
10-14 dní
407.66 €
English Secure PDF
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Non-printable
271.77 €
English Hardcopy
10-14 dní
407.66 €
French Secure PDF
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384.04 €
French Hardcopy
10-14 dní
576.06 €
German Secure PDF
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384.04 €
German Hardcopy
10-14 dní
576.06 €
Japanese Secure PDF
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Non-printable
384.04 €
Japanese Hardcopy
10-14 dní
576.06 €
Polish Secure PDF
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Non-printable
384.04 €
Polish Hardcopy
10-14 dní
576.06 €
Swedish Secure PDF
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384.04 €
Swedish Hardcopy
10-14 dní
576.06 €
View table of Contents
Standard Number:IPC-A-600 - Revision H
Published date:13.04.2010
DOD Adopted:No
ANSI Approved:No
Revision:H
ISBN (English):1-58098629-3
Pages (English):157
ISBN (Chinese):1-580986-77-3
Pages (Chinese):157
ISBN (German):978-1-61193-035-1
Pages (German):157
ISBN (French):978-1-61193-078-8
Pages (French):157
ISBN (Japanese):978-1-61193-124-2
Pages (Japanese):157
ISBN (Polish):978-1-61193-077-1
Pages (Polish):157
Pages (Swedish):157
DESCRIPTION

Latest revision for IPC-A-600 is here

The definitive illustrated guide to printed circuit board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With over 90 new or revised photographs and illustrations, revision H provides new coverage on topics such as copper wrap plating, copper cap plating of filled holes, and hole wall/barrel separation along with updated and expanded coverage for measling of printed boards, delamination and haloing, laminate voids/cracks, etchback, blind and buried via fill, and flexible circuits. The document sychronizes to the acceptability requirements expressed in IPC-6012C and IPC-6013B.