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>IPC-A-600 - Revision H
Published date: 13.04.2010
IPC-A-600 - Revision H

IPC-A-600 - Revision H

Acceptability of Printed Boards

Formát
Dostupnost
Cena a měna
Chinese Zabezpečené PDF
K okamžitému stažení
Netisknutelné
6363 Kč
Chinese Tisk
10-14 dní
9544 Kč
English Zabezpečené PDF
K okamžitému stažení
Netisknutelné
6363 Kč
English Tisk
10-14 dní
9544 Kč
French Zabezpečené PDF
K okamžitému stažení
Netisknutelné
8991 Kč
French Tisk
10-14 dní
13487 Kč
German Zabezpečené PDF
K okamžitému stažení
Netisknutelné
8991 Kč
German Tisk
10-14 dní
13487 Kč
Japanese Zabezpečené PDF
K okamžitému stažení
Netisknutelné
8991 Kč
Japanese Tisk
10-14 dní
13487 Kč
Polish Zabezpečené PDF
K okamžitému stažení
Netisknutelné
8991 Kč
Polish Tisk
10-14 dní
13487 Kč
Swedish Zabezpečené PDF
K okamžitému stažení
Netisknutelné
8991 Kč
Swedish Tisk
10-14 dní
13487 Kč
View table of Contents
Standard Number:IPC-A-600 - Revision H
Published date:13.04.2010
DOD Adopted:No
ANSI Approved:No
Revision:H
ISBN (English):1-58098629-3
Pages (English):157
ISBN (Chinese):1-580986-77-3
Pages (Chinese):157
ISBN (German):978-1-61193-035-1
Pages (German):157
ISBN (French):978-1-61193-078-8
Pages (French):157
ISBN (Japanese):978-1-61193-124-2
Pages (Japanese):157
ISBN (Polish):978-1-61193-077-1
Pages (Polish):157
Pages (Swedish):157
Popis

Latest revision for IPC-A-600 is here

The definitive illustrated guide to printed circuit board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With over 90 new or revised photographs and illustrations, revision H provides new coverage on topics such as copper wrap plating, copper cap plating of filled holes, and hole wall/barrel separation along with updated and expanded coverage for measling of printed boards, delamination and haloing, laminate voids/cracks, etchback, blind and buried via fill, and flexible circuits. The document sychronizes to the acceptability requirements expressed in IPC-6012C and IPC-6013B.