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Published date: 14.02.2012
IPC-J-STD-005 - Revision A
Requirements for Soldering Pastes
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Chinese Secure PDF
Immediate download
Non-printable
96.09 €
Chinese Hardcopy
10-14 dní
144.14 €
English Secure PDF
Immediate download
Non-printable
96.09 €
English Hardcopy
10-14 dní
144.14 €
Japanese Secure PDF
Immediate download
Non-printable
132.45 €
Japanese Hardcopy
10-14 dní
198.67 €
View table of Contents
| Standard Number: | IPC-J-STD-005 - Revision A |
| Published date: | 14.02.2012 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | A |
| ISBN (English): | 978-1-61193-038-2 |
| Pages (English): | 24 |
| ISBN (Chinese): | 978-1-61193-088-7 |
| Pages (Chinese): | 10 |
| ISBN (Japanese): | 978-1-61193-494-6 |
| Pages (Japanese): | 24 |
DESCRIPTION
Superseded by IPC-J-STD-005-Revision-B
This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005.