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Published date: 14.02.2012
IPC-J-STD-005 - Revision A
Requirements for Soldering Pastes
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Chinese Zabezpečené PDF
K okamžitému stažení
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2316 Kč
Chinese Tisk
10-14 dní
3473 Kč
English Zabezpečené PDF
K okamžitému stažení
Netisknutelné
2316 Kč
English Tisk
10-14 dní
3473 Kč
Japanese Zabezpečené PDF
K okamžitému stažení
Netisknutelné
3192 Kč
Japanese Tisk
10-14 dní
4788 Kč
View table of Contents
| Standard Number: | IPC-J-STD-005 - Revision A |
| Published date: | 14.02.2012 |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | A |
| ISBN (English): | 978-1-61193-038-2 |
| Pages (English): | 24 |
| ISBN (Chinese): | 978-1-61193-088-7 |
| Pages (Chinese): | 10 |
| ISBN (Japanese): | 978-1-61193-494-6 |
| Pages (Japanese): | 24 |
Popis
Superseded by IPC-J-STD-005-Revision-B
This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005.