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BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Vydáno: 2007-07-31
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276.93 €
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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Vydáno: 2019-04-01
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19/30357467 DC
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
Vydáno: 2019-05-13
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DD IEC/PAS 62326-14:2010
Printed boards Device embedded substrate. Terminology / reliability / design guide
Printed boards Device embedded substrate. Terminology / reliability / design guide
Vydáno: 2010-11-30
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BS EN 61191-4:2017
Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
Vydáno: 2017-11-20
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BS EN 16602-70-12:2016
Space product assurance. Design rules for printed circuit boards
Space product assurance. Design rules for printed circuit boards
Vydáno: 2016-10-31
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