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BS CECC 23300-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards
Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards
Vydáno: 1998-06-15
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BS EN 61249-8-8:1997
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings
Vydáno: 1997-12-15
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BS EN 62326-4:1997
Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
Vydáno: 1997-06-15
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BS 6221-1:1990
Printed wiring boards Guide for the specification writer
Printed wiring boards Guide for the specification writer
Vydáno: 1990-02-28
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BS EN 16602-70-60:2019
Space product assurance. Qualification and Procurement of printed circuit boards
Space product assurance. Qualification and Procurement of printed circuit boards
Vydáno: 2019-07-19
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276.19 €
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PD IEC TR 62899-402-4:2021
Printed electronics Printability. Measurement of qualities. Classification and measurement methods for morphology
Printed electronics Printability. Measurement of qualities. Classification and measurement methods for morphology
Vydáno: 2021-10-29
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BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
Vydáno: 2021-04-22
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24/30485597 DC
BS IEC 62899-402-8. Printed electronics Part 402-8. Printability. Measurement of qualities. Shape pattern dimension
BS IEC 62899-402-8. Printed electronics Part 402-8. Printability. Measurement of qualities. Shape pattern dimension
Vydáno: 2024-01-09
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