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Main page>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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258 results
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BS EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Vydáno: 2009-10-31
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BS EN 61249-3-4:1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Adhesive coated flexible polyimide film
Vydáno: 1999-06-15
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BS EN 61249-2-19:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test) copper clad
Vydáno: 2002-05-02
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BS EN 61249-2-43:2016
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2016-07-31
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BS EN 61249-8-8:1997
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings
Vydáno: 1997-12-15
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BS EN 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Vydáno: 2016-04-30
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BS CECC 23300-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards
Vydáno: 1998-06-15
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BS EN IEC 61191-1:2018 - TC
Tracked Changes. Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Vydáno: 2020-02-27
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PD IEC TR 62899-402-4:2021
Printed electronics Printability. Measurement of qualities. Classification and measurement methods for morphology
Vydáno: 2021-10-29
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BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
Vydáno: 2021-04-22
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BS EN IEC 61189-5-301:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste using fine solder particles
Vydáno: 2021-05-06
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BS EN IEC 62496-2-5:2022
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits
Vydáno: 2023-01-26
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258 results
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