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PD IEC/TR 63017:2015
Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
Vydáno: 2015-12-16
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BS EN 61249-2-21:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2004-02-16
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BS EN 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies
Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies
Vydáno: 2009-02-28
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Vydáno: 2021-03-25
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Vydáno: 2021-07-29
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BS EN 61249-5-4:1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Vydáno: 1997-05-15
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