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BS IEC 62899-403-1:2018
Printed electronics Printability. Requirements for reproducibility. Basic patterns for evaluation of printing machine
Printed electronics Printability. Requirements for reproducibility. Basic patterns for evaluation of printing machine
Vydáno: 2018-06-27
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Vydáno: 2021-03-25
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Vydáno: 2021-07-29
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BS EN 60097:1993
Specification for grid systems for printed circuits
Specification for grid systems for printed circuits
Vydáno: 1993-04-15
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BS EN 61249-5-4:1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Vydáno: 1997-05-15
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