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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Vydáno: 2019-04-01
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PD IEC PAS 61191-10:2022
Printed board assemblies Application and utilization of protective coatings for electronic assemblies
Printed board assemblies Application and utilization of protective coatings for electronic assemblies
Vydáno: 2022-09-13
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BS IEC 62899-201-2:2021
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates
Vydáno: 2022-04-06
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BS IEC 63055:2023
Format for LSI-Package-Board Interoperable design
Format for LSI-Package-Board Interoperable design
Vydáno: 2023-11-08
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PD IEC TR 62899-250:2025
Printed electronics Material technologies required in printed electronics for wearable smart devices
Printed electronics Material technologies required in printed electronics for wearable smart devices
Vydáno: 2025-03-17
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BS IEC 62899-203-2:2025
Printed electronics Materials. Semiconductor ink. Space charge limited mobility measurement in printed organic semiconductive layers
Printed electronics Materials. Semiconductor ink. Space charge limited mobility measurement in printed organic semiconductive layers
Vydáno: 2025-06-24
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