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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Vydáno: 2019-04-01
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BS IEC 62899-201-2:2021
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates
Vydáno: 2022-04-06
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BS IEC 63055:2023
Format for LSI-Package-Board Interoperable design
Format for LSI-Package-Board Interoperable design
Vydáno: 2023-11-08
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BS IEC 62899-402-8:2026
Printed electronics Printability. Measurement of qualities. Shape pattern dimension
Printed electronics Printability. Measurement of qualities. Shape pattern dimension
Vydáno: 2026-06-09
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BS IEC 62899-403-2:2026
Printed electronics Part 403-2: Printability - Requirements for reproducibility - Basic patterns for printing plate
Printed electronics Part 403-2: Printability - Requirements for reproducibility - Basic patterns for printing plate
Vydáno: 2026-03-17
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PD IEC TR 62899-250:2025
Printed electronics Material technologies required in printed electronics for wearable smart devices
Printed electronics Material technologies required in printed electronics for wearable smart devices
Vydáno: 2025-03-17
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BS IEC 62899-203-2:2025
Printed electronics Materials. Semiconductor ink. Space charge limited mobility measurement in printed organic semiconductive layers
Printed electronics Materials. Semiconductor ink. Space charge limited mobility measurement in printed organic semiconductive layers
Vydáno: 2025-06-24
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