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PD IEC/PAS 61182-12:2014
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Vydáno: 2014-10-31
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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Device embedding assembly technology Generic specification for device embedded substrates
Vydáno: 2019-12-17
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PD IEC/PAS 61249-8-1:2014
Qualification and performance of electrical insulating compound for printed wiring assemblies
Qualification and performance of electrical insulating compound for printed wiring assemblies
Vydáno: 2014-06-30
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BS IEC 62899-202-5:2018
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
Vydáno: 2018-10-09
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BS EN 61249-2-2:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2006-06-30
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BS EN 61188-5-4:2007
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
Vydáno: 2007-12-31
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