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PD IEC/PAS 61249-8-1:2014
Qualification and performance of electrical insulating compound for printed wiring assemblies
Qualification and performance of electrical insulating compound for printed wiring assemblies
Vydáno: 2014-06-30
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BS IEC 62899-202-5:2018
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
Vydáno: 2018-10-09
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BS 123500:2001
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
Vydáno: 2001-12-17
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BS EN 61188-5-2:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
Vydáno: 2003-10-16
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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Vydáno: 2021-08-20
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BS IEC 62899-201:2016+A1:2018
Printed electronics Materials. Substrates
Printed electronics Materials. Substrates
Vydáno: 2019-01-03
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BS IEC 62899-202-7:2021
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Vydáno: 2021-03-11
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