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BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Vydáno: 2021-12-24
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BS EN 62326-1:2002
Printed boards Generic specification
Printed boards Generic specification
Vydáno: 2002-08-16
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BS EN 61191-3:2017
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Vydáno: 2017-09-25
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BS EN 61249-2-23:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2005-08-25
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BS 123500:2001
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
Vydáno: 2001-12-17
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BS IEC 62899-202-7:2021
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Vydáno: 2021-03-11
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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Vydáno: 2021-08-20
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BS IEC 62899-201:2016+A1:2018
Printed electronics Materials. Substrates
Printed electronics Materials. Substrates
Vydáno: 2019-01-03
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