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BS 123500-003:2001
System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
Vydáno: 2001-12-17
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BS 123600:2001
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
Vydáno: 2001-12-17
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BS EN 61191-3:2017 - TC
Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Tracked Changes. Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
Vydáno: 2020-02-26
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BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Vydáno: 2021-04-07
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197.62 €
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169.05 €
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364.29 €
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BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Vydáno: 2019-11-18
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276.19 €
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