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>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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256 results
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BS EN 61249-2-5:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2006-07-31
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BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Vydáno: 1997-12-15
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BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Vydáno: 2002-05-14
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BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA
Vydáno: 2021-11-05
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BS 123200-003:2001
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
Vydáno: 2001-12-17
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BS EN 61249-4-2:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Multifunctional expoxide woven E-glass prepeg of defined flammability
Vydáno: 2006-02-01
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PD IEC/TR 62878-2-2:2015
Device embedded substrate Guidelines. Electrical testing
Vydáno: 2015-12-31
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19/30379185 DC
BS EN 63203-406-1. Wearable electronic devices and technologies Part 406-1. Test methods of wrist worn wearable electronic devices for measuring skin contact temperature
Vydáno: 2019-01-31
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BS EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
Vydáno: 2006-02-01
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BS EN 61086-3-1:2004
Coatings for loaded printed wire boards (conformal coatings) Specifications for individual materials
Vydáno: 2004-05-21
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BS EN 123400-800:1992
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
Vydáno: 1991-12-20
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BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Vydáno: 2019-11-18
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256 results
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